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Katayama, Isao; |
Compound machining apparatus

A compound machining apparatus in which a punch press and a movable table device are provided on separate frames, respectively, and a laser oscillator, a laser beam machining head and a tube for guiding a laser beam from the laser oscillator to the laser beam machining head are collectively placed on the same frame as the frame of the movable table device.


What is claimed is:
1. A compound machining apparatus comprising a punch press, a laser oscillator having a long side and a movable table device having a table movable in a first direction, characterized in that the punch press and the movable table device are provided on separate frames, respectively, and the laser oscillator, a laser beam machining head and a guide tube for guiding a laser beam from the laser oscillator to the laser beam machining head are collectively placed on the same frame as the frame of said movable table device, wherein the long side of the laser oscillator is arranged substantially perpendicular to the first direction.
2. The compound machining apparatus as claimed in claim 1, wherein said movable table device movably supports a plate within a plane to bring a suitable position of the plate to a position of a punch machining head and to that of a laser beam machining head, and is composed of two tables movable in a direction toward the punch press, a fixed table between the two movable tables, a carriage moving integral with the movable tables, and a work holder for holding a work sheet which is provided on the carriage and moving in a direction rectangular to the moving direction of the carriage.
3. The compound machining apparatus as claimed in claim 2, wherein said laser beam machining head and said punch machining head are arranged on the same line in one of moving directions of the work sheet.
4. The compound machining apparatus as claimed in claim 1, wherein said laser oscillator is mounted to the frame of the movable table device by means of a plurality of shafts projectingly provided from the lower surface of the laser oscillator toward vertical and downward portion, linear bearings provided on the frame and supporting movably.,up and down the shafts which are inserted thereinto, an air spring which is expanded by feed and discharge of air between the bottom surface of the laser oscillator and the frame, and a fluid cylinder formed with a flange portion at the end of a rod extending through the frame and provided between the bottom surface of the laser oscillator and the frame.
5. The compound machining apparatus as claimed in claim 4, wherein a flange portion is formed at the end of said shaft so that when the flange portion and in upper surface of the linear bearings are placed in close contact, the laser oscillator assumes an accurate horizontal attitude.
6. The compound machining apparatus as claimed in claim 1, wherein said laser beam machining head is mounted at the end portion of a laser frame extending from the frame supporting the laser oscillator toward the punch press and having the guide tube for guiding the laser beam, and comprises a vertical guide tub for vertically guiding a laser beam reflected by a mirror provided on the front end of the guide tube, a focusing device retaining a lens at the lower end of the vertical guide tube, and a supporting device for vertically movably supporting front portions of the focusing device, vertical guide tube and guide tube.
7. The compound machining apparatus as claimed in claim 6, wherein a lens holder with a lens fitted therein is threadedly mounted within a tapped hole which is formed in a block having a nozzle at the lowermost end of the machining head so that the lens is cleaned and checked by removing the lens holder from the top of the block.
8. A compound machining apparatus operable with a punch press, a laser oscillator having a long side and a movable table device having a table which is movable in a first direction, said apparatus comprising:
a first frame for supporting the punch press; and
a second frame, independent of said first frame, for supporting the laser oscillator and the movable table device, said second frame adapted to support the laser oscillator with the long side of the laser oscillator arranged substantially perpendicular to the first direction.
9. A compound machining apparatus as claimed in claim 8, further comprising:
a laser beam machining head supported by said second frame;
a guide tube for guiding a laser beam from the laser oscillator to the laser beam machining head, said guide tube being supported by said second frame.
10. A compound machining apparatus as claimed in claim 8, wherein the laser oscillator is provided within a casing having a long side and said second frame is adapted to support the casing with the long side or the casing arranged substantially perpendicular to the first direction.
11. A compound machining apparatus as claimed in claim 9, wherein the laser oscillator is provided within a casing having a long side and said second frame is adapted to support the casing with the long side of the casing arranged substantially perpendicular to the first direction.
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