Katada, Mitsutaka; Tsuruta, Kazuhiro; Fujino, Seiji; Onoda, Michitoshi;

Method of bonding semiconductor substrates

In a method of bonding semiconductor substrates, a plurality of the semiconductor substrates are first prepared. Surfaces of the semiconductor substrates are mirror-polished. The mirror-polished surface of at least one of the semiconductor substrates is then provided with a hydrophilic property in such a way that an oxide layer is formed on the mirror-polished surface by exposing the mirror-polished surface to an atmosphere of at least one of an oxygen ion and an oxygen radical. A water molecule is then adhered to the mirror-polished surface. The semiconductor substrates then contact with each other through the mirror-polished surface. The contacted semiconductor substrates are then heated. According to such a method of bonding, the semiconductor substrates are strongly bonded to each other with hardly an unbonded region even if the semiconductor substrates are heated at a low temperature.

• Selenium rectifier Pitot tube assembly
• Training apparatus for singing Hydraulic drive for control rods
• Modifiable IC board Combination commode construction
• Pizza cutter Method for treating hyperoxia
• Precursors of heterofuranobenzoxepin acetic acids Tooth rest for cutter grinder
• Recombinant coccidiosis vaccines Bird feeder
• Electromagnetic effect material Security lock mechanism
• Heat sink retention frame Spacer for reinforcements
• Reverse osmosis assembly operating valve Timing game
• Female urine specimen collection device Process for solution mining
• Control device Simple tooling exchange
• Expanded chamber centrifugal drying mill Triglyceride enhanced pyrethrin-based arthropodicidal composition
• IC card connector Sampling system for mass spectrometer
• Acceleration sensor Inbred maize line PH1TB
• Moving table flap Vinylcyclopropanecarboxylic acid esters
• Microelectronic circuit coating system Refrigerating cycle
• Drinking vessel with adjustable handles Optical fiber array connector
• Treatment of agricultural waste

What is claimed is:

1. A method of bonding semiconductor substrates, which comprises the steps of:

(a) preparing a plurality of silicon substrates which have surfaces that are mirror-polished;

(b) providing said mirror-polished surface of at least one of said silicon substrates with a hydrophilic property and with an oxygen concentration which is in a range of 64-73% and said oxygen concentration which gradually becomes lower toward inside said silicon substrate with said hydrophilic property by coupling said at least one of said silicon substrates to a cathode of an electrically biased system and forming an oxide layer on said mirror-polished surface by exposing said mirror-polished surface to an atmosphere including positive oxygen ions;

(c) adhering water molecules to said mirror-polished surface;

(d) contacting said silicon substrates with each other through said mirror-polished surface; and

(e) heating said contacted silicon substrates at a temperature of less than 600.degree. C. to bond strongly said contacted silicon substrates.

2. A method of bonding semiconductor substrates according claim 1, wherein said oxygen concentration is in a range of 68-70%.

3. A method of bonding semiconductor substrates according to claim 1, wherein a surface roughness Ra of said mirror-polished surface is less than 5 nm.

4. A method of bonding semiconductor substrates according to claim 1, wherein said step (b) is carried out in a situation that said at least one of semiconductor substrates is put in a vacuum system and is cathode-coupled.

5. A method of bonding semiconductor substrates according to claim 1, wherein said step(c) is a step of washing said at least one of semiconductor substrates in pure water.

6. A method of bonding semiconductor substrates according to claim 1, wherein said step (c) is a step of forming a silanol group on said mirror-polished surface.

7. A method of bonding semiconductor substrates according to claim 1, wherein said step (e) is carried out in a situation that an electric voltage is supplied between said semiconductor substrates.

8. A method of bonding semiconductor substrates according to claim 7, said electric voltage is in a range of 100-500 V.

9. A method of bonding semiconductor substrates according to claim 1, wherein said step (e) is a step of heating at less than 450.degree. C.

10. A method of bonding semiconductor substrates according to claim 1, comprising the further step of forming a semiconductor element having a metallic wiring on said at least one of semiconductor substrates before said step (b).

11. A method of bonding semiconductor substrates according to claim 10, wherein said step (e) is a step of heating at a temperature which is less than the melting point of said metallic wiring.

12. A method of bonding semiconductor substrates according to claim 11, wherein one of said semiconductor substrates is a sensing portion of a semiconductor pressure sensor, the other of said semiconductor substrates, is a stage of said semiconductor pressure sensor, and said semiconductor element has a strain gauge.

13. A method of bonding semiconductor substrates according to claim 1, wherein said atmosphere includes oxygen radicals.

14. A method of bonding semiconductor substrates according to claim 1, wherein said oxide layer is formed at normal temperature.

15. A method of manufacturing a semiconductor pressure sensor, which comprises the steps of:

(a) preparing two silicon substrates with mirror-polished surfaces;

(b) forming a strain gauge and a metallic wiring on at least one of said silicon substrates;

(c) providing said mirror-polished surface of at least one of said silicon substrates with a hydrophilic property in such a way that said at least one of said silicon substrates is coupled to a cathode of an electrically biased system and that an oxide layer is formed on said mirror-polished surface by exposing said mirror-polished surface to an atmosphere including positive oxygen ions, wherein an oxygen concentration of said mirror-polished surface is in a range of 64-73% and said oxygen concentration gradually becomes lower toward inside said silicon substrate with said hydrophilic property;

(d) adhering water molecules to said mirror-polished surface;

(e) contacting said two silicon substrates with each other through said mirror-polished surface; and

(f) heating said contacted two silicon substrates at a temperature which is less than the melting point of said metallic wiring to bond strongly said contacted two silicon substrates.

16. A method of manufacturing a semiconductor pressure sensor according to claim 15, wherein said oxygen concentration is in a range of 68-70%.

17. A method of bonding semiconductor substrates according to claim 15, wherein said atmosphere includes oxygen radicals.

18. A method of bonding semiconductor substrates according to claim 15, wherein said oxide layer is formed at normal temperature.

19. A method of bonding semiconductor substrates, which comprises the steps of:

(a) preparing a plurality of silicon substrates, surfaces of said silicon substrates being mirror-polished;

(b) disposing at least one of said silicon substrates in a vacuum environment;

(c) providing an atmosphere including positive oxygen ions on said mirror-polished surface of said one of said silicon substrate to form an oxide layer thereon so that said mirror-polished surface of said one of said silicon substrates is provided with a hydrophilic property; wherein said positive oxygen ions contribute to an oxidation reaction, an oxygen concentration of said mirror-polished surface is in a range of 64-73% and said oxygen concentration gradually becomes lower toward inside said silicon substrate with said hydrophilic property;

(d) adhering water molecules to said mirror-polished surface;

(e) contacting said silicon substrates with each other through said mirror-polished surface; and

(f) heating said contacted silicon substrates at less than 450.degree. C. to bond strongly said contacted silicon substrates.

20. A method of bonding semiconductor substrates according to claim 19, wherein said atmosphere includes oxygen radicals.

21. A method of bonding semiconductor substrates according to claim 19, wherein said oxide layer is formed at normal temperature.